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AC analysis of MOSFETs: Device performance, interconnections, and circuit reliability.

机译:MOSFET的交流分析:器件性能,互连和电路可靠性。

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摘要

The ac characteristics of MOSFET in terms of device performance, interconnections, and circuit reliability are studied. At device level, the scattering parameters of silicon MOSFETs are measured in the frequency domain for scaled devices. The gate resistance delay effects are characterized and modeled. Simulations using SPICE and measurement data are compared. Qualitatively, L-, II-, T-ladder models are investigated for both the real and imaginary parts of ;For interconnections, polysilicon line capacitances are measured and compared with the simulation results of PISCES. A well isolation technique was used to reduce the parasitic capacitances of the bonding pad. Using this method, the capacitances for different lengths and widths are measured successfully and proved to agree well with simulation results. It is confirmed that small sized test structures are adequate for various measurement purposes using this well isolation technique since the variations of parasitic capacitance various structures can be minimized. From line capacitance measurement data, the fringing capacitance, which becomes important in the horizontally scaled VLSI circuits, is estimated by extrapolation.;For circuits, the metastability of CMOS latch/flip-flops are measured and modeled. An ac frequency domain approach is adopted and this method suggests several optimal design approaches for the inverter ratio, aspect ratio, and circuit configurations. This frequency domain approach proved to be advantageous compared with the usual time domain one. The mean time between failures (MTBF) due to the metastable state has been measured using the late detection method, and the data confirms our optimal design approach. The dependence of the metastability on the Miller effect is studied for the optimal configurations. The power supply disturbance and chip temperature variation effects are measured and compared; they agree well with the ac small signal simulations, therefore confirming the ac small signal frequency domain approach. Parameters such as the threshold voltage, gate oxide thickness, substrate doping, and static noise margin are characterized in terms of their sensitivities on the metastability. Desirable selections of those parameters are suggested as well.
机译:研究了MOSFET的交流特性,包括器件性能,互连和电路可靠性。在器件级别,可在按比例缩放器件的频域中测量硅MOSFET的散射参数。对栅极电阻延迟效应进行了表征和建模。比较了使用SPICE和测量数据进行的仿真。定性地研究了L,II,T梯形模型的实部和虚部;对于互连,测量多晶硅线电容并将其与PISCES的仿真结果进行比较。使用了良好的隔离技术来减小焊盘的寄生电容。使用该方法,成功测量了不同长度和宽度的电容,并证明与仿真结果吻合良好。可以肯定的是,由于可以将各种结构的寄生电容的变化减至最小,因此采用这种阱隔离技术的小型测试结构足以满足各种测量目的。根据线路电容测量数据,通过外推法估算在水平缩放VLSI电路中变得非常重要的边缘电容。对于电路,对CMOS锁存器/触发器的亚稳性进行测量和建模。采用交流频域方法,该方法为逆变器比率,纵横比和电路配置提出了几种最佳设计方法。与通常的时域相比,这种频域方法被证明是有利的。使用后发现方法测量了由于亚稳态导致的平均故障间隔时间(MTBF),这些数据证实了我们的最佳设计方法。研究了亚稳性对米勒效应的依赖性,以获得最佳构型。测量并比较电源干扰和芯片温度变化的影响;它们与交流小信号仿真非常吻合,因此证实了交流小信号频域方法。诸如阈值电压,栅极氧化物厚度,衬底掺杂和静态噪声容限之类的参数是根据其对亚稳性的敏感性来表征的。还建议对这些参数进行理想的选择。

著录项

  • 作者

    Kim, Lee-Sup.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1990
  • 页码 128 p.
  • 总页数 128
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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