首页> 外文会议>Tenth International Symposium on Silicon-on-Insulator Technology and Devices Ⅹ, 10th, Mar 25-29, 2001, Washington DC >REDUCTION OF DYNAMIC LEAKAGE CURRENT FOR 0.18μm SOI DEVICES BY USING RETROGRADED CHANNEL STRUCTURE
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REDUCTION OF DYNAMIC LEAKAGE CURRENT FOR 0.18μm SOI DEVICES BY USING RETROGRADED CHANNEL STRUCTURE

机译:改进的通道结构降低了0.18μmSOI器件的动态漏电流

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摘要

The behavior of dynamic leakage current (DLC) in 0.18μm silicon-on-insulator (SOI) MOS transistors with uniformly doped channel and super steep retrograde (SSR) channel was investigated by pulsed I-V measurement and MEDICI device simulation. For a uniform doped channel structure, a SOI device with the SOI thickness 150nm had the maximum DLC, which decreased for thinner and thicker SOI devices than the 150nm SOI. For a SSR channel structure, the DLC linearly decreased with increasing the SOI thickness and could be effectively reduced compared to the uniform structure. For thinner SOI devices, DLC was mainly dependent on the accumulated hole concentration. On the contrary, for thicker SOI devices, DLC was dominant on the body-to-source potential. It is concluded that the use of a thicker SOI with SSR channel structure is an effective method for reducing the DLC in SOI MOS transistors.
机译:通过脉冲IV测量和MEDICI器件仿真研究了0.18μm均匀掺杂沟道和超陡逆向(SSR)沟道绝缘体上硅(SOI)MOS晶体管的动态漏电流(DLC)行为。对于均匀的掺杂沟道结构,SOI厚度为150nm的SOI器件具有最大DLC,与150nm SOI相比,对于越来越薄的SOI器件,其DLC减小。对于SSR通道结构,DLC随着SOI厚度的增加而线性减小,并且与均匀结构相比可以有效地减小。对于更薄的SOI器件,DLC主要取决于累积的空穴浓度。相反,对于较厚的SOI器件,DLC在体源能方面占主导地位。结论是,使用具有SSR沟道结构的较厚SOI是减少SOI MOS晶体管DLC的有效方法。

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