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Formation and Properties of Three Copper Pairs in Silicon

机译:硅中三个铜对的形成和性质

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Copper in silicon is a feared contaminant in device processing. It diffuses quickly as an interstitial and forms electrically active precipitates that are difficult to dissolve. Several complexes assigned to copper pairs have been observed but have yet to be unambiguously identified and fully characterized. We present the results of joint theoretical-experimental studies of several pair structures. The theoretical work involves ab-initio molecular-dynamics simulations, and the results include configurations, binding energies, electronic structures, vibrational modes and formation dynamics. The experimental work combines electrical and optical techniques. One characteristic of the photoluminescence spectra is the presence of phonon replicas that imply the existence of very similar low-frequency and localized vibrational modes in two distinct copper pairs. These modes are theoretically identified.
机译:硅中的铜是器件加工中令人担忧的污染物。它以间隙的形式迅速扩散,并形成难以溶解的电活性沉淀物。已经观察到分配给铜对的几种络合物,但尚未明确鉴定和充分表征。我们提出了几个对结构的联合理论-实验研究的结果。理论工作涉及从头开始的分子动力学模拟,结果包括构型,结合能,电子结构,振动模式和地层动力学。实验工作结合了电学和光学技术。光致发光光谱的一个特征是声子复制体的存在,这意味着在两个不同的铜对中存在非常相似的低频和局部振动模式。这些模式在理论上是确定的。

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