METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRATE HAVING THROUGH-SILICON VIAS, AND COPPER PASTE FOR THROUGH-SILICON VIA FORMATION

摘要

This method for producing a substrate having through-silicon vias according to one embodiment comprises: a preparation step for preparing a silicon substrate having through-holes that communicate with both main surfaces; a copper sintered body formation step for forming a copper sintered body having a porous structure, such that the copper sintered body fills at least through-holes; a resin impregnation step for impregnating the copper sintered body with a curable resin composition; and a resin curing step for curing the curable resin composition that has impregnated the copper sintered body and thereby forming a conductor that is constituted of the copper sintered body having pores packed with resin cured product, to provide through-silicon vias in the through-holes.