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A Fully Analytical Model for the Series Impedance of Through-Silicon Vias With Consideration of Substrate Effects and Coupling With Horizontal Interconnects

机译：考虑衬底效应和耦合水平互连的硅通孔串联阻抗的完全分析模型

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Chuan Xu; Student Member; Vassilis Kourkoulos; Roberto Suaya; Senior Member; Kaustav Banerjee;
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年度 2014
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1. A Fully Analytical Model for the Series Impedance of Through-Silicon Vias With Consideration of Substrate Effects and Coupling With Horizontal Interconnects [J] . Xu C., Kourkoulos V., Suaya R., Electron Devices, IEEE Transactions on . 2011,第10期

机译：考虑衬底效应和水平互连耦合的硅通孔串联阻抗的完整分析模型
2. An Analytical Capacitance Model for Through-Silicon Vias in Floating Silicon Substrate [J] . Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, IEEE Transactions on Electron Devices . 2016,第3期

机译：浮动硅衬底中硅通孔的分析电容模型
3. Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards [J] . John H. Lau, M. S.Zhang, S. W. Ricky Lee Journal of Electronic Packaging . 2011,第3期

机译：具有硅通孔的嵌入式三维混合集成电路集成系统级封装，用于有机基板/印刷电路板中的光电互连
4. Analytical heat transfer model for thermal through-silicon vias [C] . Xu Hu, Pavlidis Vasilis F., De Micheli Giovanni 2011 Design, Automation Test in Europe Conference Exhibition . 2011

机译：热硅通孔的解析传热模型
5. High-frequency impedance extraction of interconnects considering substrate effects and exploration of single-walled carbon nanotubes for future VLSI interconnects. [D] . Srivastava, Navin. 2009

机译：考虑衬底效应的互连线的高频阻抗提取和用于未来VLSI互连线的单壁碳纳米管的探索。
6. Modeling of misalignment effects in microfluidic interconnects for modular bio-analytical chip applications [O] . Sudheer D. Rani, Taehyun Park, Byoung Hee You, -1

机译：用于模块化生物分析芯片应用的微流体互连中的未对准效应建模
7. Wire-bonded through-silicon vias with low capacitive substrate coupling [O] . A C Fischer, M Grange, N Roxhed, 2011

机译：具有低电容基板耦合的引线通过硅通孔通孔

A Fully Analytical Model for the Series Impedance of Through-Silicon Vias With Consideration of Substrate Effects and Coupling With Horizontal Interconnects

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