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Formation and properties of three copper pair in silicon

机译:三铜对在硅中的形成与性质

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Copper in silicon is a feared contaminant in device processing. It diffuses quickly as an interstitial and forms electrically active precipitates that are difficult to dissolve. Several complexes assigned to copper pairs have been observed but have yet to be unambiguously identified and fully characterized. We present the results of joint theoretical-experimental studies of several pair structures. The theoretical work involves ab-initio molecular-dynamics simulations, and the results include configurations, binding energies, electronic structures, vibrational modes and formation dynamics. The experimental work combines electrical and optical techniques. One characteristic of the photoluminescence spectra is the presence of phonon replicas that imply the existence of very similar low-frequency and localized vibrational modes in two distinct copper pairs. These modes are theoretically identified.
机译:硅中的铜是设备处理中的令人恐惧的污染物。它迅速扩散为间质,形成难以溶解的电活性沉淀物。已经观察到分配给铜对的几个复合物,但尚未明确识别和完全表征。我们介绍了几对结构的联合理论实验研究结果。理论作品涉及AB-Initio分子 - 动力学模拟,结果包括配置,粘合能量,电子结构,振动模式和形成动态。实验工作结合了电气和光学技术。光致发光光谱的一个特征是存在声子副本的存在,这意味着在两个不同的铜对中存在非常相似的低频和局部振动模式。这些模式是理论上识别的。

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