首页> 外文会议>Sixth International Symposium on High Purity Silicon VI, Oct 22-27, 2000, Phoenix, Arizona >FORMATION AND ANNIHILATION OF EPITAXIAL STACKING FAULTS GENERATED FROM PRE-EXISTING NUCLEATION SITES IN SILICON
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FORMATION AND ANNIHILATION OF EPITAXIAL STACKING FAULTS GENERATED FROM PRE-EXISTING NUCLEATION SITES IN SILICON

机译:硅中预先存在的成核位点产生的表位堆积断裂的形成和消失

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Pre-existing saucer-pit induced epitaxial stacking fault formation has been investigated in silicon. Using inductively coupled plasma mass spectroscopy, metallic impurities and low temperature out-diffusion of Cu have been studied in the as-received wafers. It is revealed that near ten times higher Cu contamination than that of usual incoming levels is observed on the surface of the samples. The distribution of the defects revealed after epi growth is exactly corresponding to the striated off-centered patterns of the saucer pits (S-pit), which is strongly affected by the oxygen precipitates in the sample contaminated with homogeneous surface metallic impurities. We have also observed that the S-pits are not formed in the samples with oxygen contents of ~16 ppma and an optimized oxidation temperature for proper bulk defect density and oxidation-induced stacking faults at the wafer backside. This result indicates that the S-pit formation is suppressed by the improved intrinsic/extrinsic gettering efficiency.
机译:已经研究了硅中先前存在的碟坑诱发的外延堆叠断层的形成。使用电感耦合等离子体质谱法,已经研究了在接收的晶片中金属杂质和低温的铜外扩散。据发现,在样品表面上观察到的铜污染比通常的进入水平高近十倍。外延生长后发现的缺陷分布与碟形凹坑(S凹坑)的横线偏心图案完全对应,该图案受样品中被均匀表面金属杂质污染的氧气沉淀的强烈影响。我们还观察到,在氧含量约为16 ppma且最佳氧化温度的样品中未形成S坑,以确保适当的体缺陷密度和氧化引起的晶圆背面堆叠缺陷。该结果表明,通过改善的固有/非固有吸杂效率,抑制了S坑的形成。

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