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Avalanche Breakdown Characteristics of 4H-SiC Graded p~+-n Junction Formed with Aluminum Ion-implanted p~+-layer

机译:铝离子注入p〜+层形成的4H-SiC梯度p〜+ -n结的雪崩击穿特性

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The avalanche breakdown characteristics of a graded p~+-n junction formed with aluminum ion-implantation for 4H-SiC were investigated. The breakdown voltage of the graded p~+-n junction was calculated using a commercial process/device simulator and considering the ion-implanted distribution of aluminum. To compare the calculated results to the experimental results, a p~+~+ diode with an aluminum ion-implanted p~+-layer was fabricated on a 2.8-μm-thick 1.1 × 10~(17)-cm~(-3) n-type epitaxial layer. The breakdown voltage of the fabricated diode showed a higher breakdown voltage than that of the calculation. The cause of the difference in the breakdown voltages between the fabricated diode and the calculation is discussed.
机译:研究了铝离子注入4H-SiC形成的渐变p〜+ -n结的雪崩击穿特性。使用商业化的过程/设备模拟器并考虑了离子注入的铝分布,计算了渐变的p〜+ -n结的击穿电压。为了将计算结果与实验结果进行比较,在厚度为2.8μm的1.1×10〜(17)-cm〜厚度上制作了带有铝离子注入p〜+层的ap〜+ / n / n〜+二极管。 (-3)n型外延层。所制造的二极管的击穿电压显示出比计算结果更高的击穿电压。讨论了所制造的二极管与计算之间的击穿电压差异的原因。

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