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Investigation of breakdown behavior for AlGaN HEMTs

机译:AlGaN HEMT的击穿行为研究

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The ability to accurately determine the breakdown voltage of microwave transistors is critical to the design of high power microwave amplifiers. The optimal bias point and output impedance should be selected to ensure that the load line of the device during peak output power does not intersect the portion of the IV curve where the device breaks down [1]. A technique that has proven useful for the measuring off-state breakdown voltage for FETs was reported on by Bahl and del Alamo in 1993 [2]. This procedure works well for a variety of devices including microwave GaAs MESFETs, as described in the original article, and GaAs HEMTs. Fig. 1 shows the circuit diagram for the gate breakdown measurement system. The procedure for the measurement consists of using a current source to force a fixed current through the drain. The voltage on the gate is swept from zero to a negative value, while the voltage on the drain is allowed to float to whatever value is required to force the drain current. Bahl and del Alamo use a rule of thumb for the drain current of 1mA/mm [2]. This has proven to be a useful standard for GaAs MESFETs and HEMTs.
机译:准确确定微波晶体管的击穿电压的能力对于高功率微波放大器的设计至关重要。应该选择最佳偏置点和输出阻抗,以确保在峰值输出功率期间,器件的负载线不会与器件损坏的IV曲线部分相交[1]。 Bahl和del Alamo于1993年报道了一种已证明对测量FET的断态击穿电压有用的技术[2]。此过程对于包括原始文章中所述的微波GaAs MESFET和GaAs HEMT在内的各种器件都适用。图1显示了栅极击穿测量系统的电路图。测量过程包括使用电流源迫使固定电流通过漏极。栅极上的电压从零扫描到负值,而漏极上的电压则允许浮动到强制漏极电流所需的任何值。 Bahl和del Alamo使用经验法则将漏极电流设为1mA / mm [2]。对于GaAs MESFET和HEMT,这已被证明是有用的标准。

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