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Investigation of breakdown behavior for AlGaN HEMTs

机译:Algan HEMTS对击穿行为的调查

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The ability to accurately determine the breakdown voltage of microwave transistors is critical to the design of high power microwave amplifiers. The optimal bias point and output impedance should be selected to ensure that the load line of the device during peak output power does not intersect the portion of the IV curve where the device breaks down [1]. A technique that has proven useful for the measuring off-state breakdown voltage for FETs was reported on by Bahl and del Alamo in 1993 [2]. This procedure works well for a variety of devices including microwave GaAs MESFETs, as described in the original article, and GaAs HEMTs. Fig. 1 shows the circuit diagram for the gate breakdown measurement system. The procedure for the measurement consists of using a current source to force a fixed current through the drain. The voltage on the gate is swept from zero to a negative value, while the voltage on the drain is allowed to float to whatever value is required to force the drain current. Bahl and del Alamo use a rule of thumb for the drain current of 1mA/mm [2]. This has proven to be a useful standard for GaAs MESFETs and HEMTs.
机译:准确地确定微波晶体管的击穿电压的能力对于高功率微波放大器的设计至关重要。应选择最佳偏置点和输出阻抗,以确保在峰值输出功率期间设备的负载线不会与器件断开的IV曲线的部分与峰值曲线的部分相交。 1993年通过Bahl和Del Alamo报道了一种用于测量FET的脱态击穿电压的技术[2]。该程序适用于各种设备,包括微波GaAs Mesfet,如原始文章和GaAs Hemts所述。图。图1示出了栅极击穿测量系统的电路图。测量程序包括使用电流源来强制通过漏极的固定电流。栅极上的电压从零到负值扫描到负值,而漏极上的电压允许浮动以迫使漏极电流所需的任何值。 BAHL和DEL ALAMO使用拇指的漏极电流为1mA / mm [2]。这已证明是Gaas Mesfets和Hemts的有用标准。

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