首页> 外文期刊>IEEE Electron Device Letters >Normally Off AlGaN/GaN Low-Density Drain HEMT (LDD-HEMT) With Enhanced Breakdown Voltage and Reduced Current Collapse
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Normally Off AlGaN/GaN Low-Density Drain HEMT (LDD-HEMT) With Enhanced Breakdown Voltage and Reduced Current Collapse

机译:常态关闭的AlGaN / GaN低密度漏极HEMT(LDD-HEMT),具有增强的击穿电压和减小的电流崩塌

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We report a low-density drain high-electron mobility transistor (LDD-HEMT) that exhibits enhanced breakdown voltage and reduced current collapse. The LDD region is created by introducing negatively charged fluorine ions in the region between the gate and drain electrodes, effectively modifying the surface field distribution on the drain side of the HEMT without using field plate electrodes. Without changing the device physical dimensions, the breakdown voltage can be improved by 50% in LDD-HEMT, and the current collapse can be reduced. No degradation of current cutoff frequency $(f_{t})$ and slight improvement in power gain cutoff frequency $(f_{max})$ are achieved in the LDD-HEMT, owing to the absence of any additional field plate electrode.
机译:我们报告了一种低密度漏极高电子迁移率晶体管(LDD-HEMT),它具有更高的击穿电压和更低的电流崩溃。通过在栅电极和漏电极之间的区域中引入带负电荷的氟离子来创建LDD区域,从而无需使用场板电极即可有效地修改HEMT漏侧的表面场分布。在不改变器件物理尺寸的情况下,LDD-HEMT中的击穿电压可以提高50%,并且可以减少电流崩溃。由于没有任何附加的场板电极,所以在LDD-HEMT中,没有实现电流截止频率$(f_ {t})$的降低和功率增益截止频率$(f_ {max})$的轻微改善。

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