JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20℃ TO +80℃ THERMAL CYCLE TEST

摘要

Thermal cycle testing was conducted by Boeing Research &rnTechnology (Seattle) for the Joint Council on AgingrnAircraft/Joint Group on Pollution Prevention (JCAA/JG-PP)rnLead-Free Solder Project. The JCAA/JG-PP Consortium isrnthe first group to test the reliability of lead-free solder jointsrnagainst the requirements of the aerospace/militaryrncommunity.rnThe solder alloys selected for test were:rnSn3.9Ag0.6Cu for reflow and wave solderingrnSn3.4Ag1.0Cu3.3Bi for reflow solderingrnSn0.7Cu0.05Ni for wave solderingrnSn37Pb for reflow and wave solderingrnTest vehicles were assembled using these solders and arnvariety of component types and the test vehicles werernthermally cycled from -20℃ to +80℃. At the conclusionrnof the test, 27,135 thermal cycles had been accumulated.rnThe solder joints on the components were electricallyrnmonitored using event detectors and any solder joint failuresrnwere recorded on a Labview-based data collection system.rnThe failures of a given component type attached with SnPbrnsolder were compared to the failures of the same componentrntype attached with lead-free solders by using Weibullrnanalysis.