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A detailed investigation of the impact of varying number of dot layers in strain-coupled multistacked InAs/GaAs quantum dot heterostructures

机译:应变耦合多堆叠InAs / GaAs量子点异质结构中点层数目变化的影响的详细研究

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Strain-coupled InAs quantum dot (QD) heterostructures has been compared in terms of their optical properties, with varying the number of stacks. Each structure consists of seed layer dots (2.5 monolayer of InAs) with a capping layer of 6.5nm GaAs followed by active layer dots (2.1 monolayer of InAs). The active layer QD with the capping layer is repeated by one, two, four, and six times in bilayer, trilayer, pentalayer, and heptalayer samples, respectively. Thickness of the GaAs spacer layer in between active layer QD stacks is different for each structure. A red shift in photoluminescence (PL) emission was obtained for the strain-coupled multi-stack samples compared to the conventional uncoupled one. This is due to the formation of larger dot size in coupled structures. We also observed a monomodal dot distribution till the pentalayer sample, but after that a bimodal distribution was found, which may be due to the enhancement of strain as we further increase the stacks. Compared to an uncoupled sample, all coupled samples exhibited lower full width at half maximum (FWHM) values (uncoupled-35.89nm, bilayer-32.83nm, trilayer-30.17nm, pentalayer-68.91nm, and heptalayer-67.55nm) which attributes to homogeneous dot size distribution. Higher activation energies were measured in coupled samples compared to the conventional uncoupled one. Trilayer sample claimed the highest PL activation energy of 303.42meV, whereas the uncoupled sample has only 243.89meV. This increased activation energy in the coupled structures will be helpful for lower dark current in the devices.
机译:已经对应变耦合的InAs量子点(QD)异质结构的光学性质进行了比较,并随堆栈数量的变化而变化。每个结构都由具有6.5nm GaAs覆盖层的种子层点(InAs的2.5单层)和有源层点(InAs的2.1单层)组成。带有覆盖层的有源层QD在双层,三层,五层和七层样品中分别重复一,二,四和六次。有源层QD堆叠之间的GaAs间隔层的厚度对于每种结构而言是不同的。与传统的非耦合样品相比,应变耦合的多叠层样品的光致发光(PL)发射发生了红移。这是由于在耦合结构中形成了较大的点大小。我们还观察到直到五层样品为止的单峰点分布,但此后发现了双峰分布,这可能是由于随着我们进一步增加堆叠而增加了应变。与未耦合的样本相比,所有耦合的样本均显示出较低的半峰全宽(FWHM)值(未耦合的35.89nm,双层32.83nm,三层30.17nm,五层68.91nm和七层67.55nm)点大小均匀分布。与传统的未耦合样品相比,在耦合样品中测得的活化能更高。三层样品具有最高的PL活化能303.32meV,而未耦合的样品只有243.89meV。耦合结构中增加的激活能将有助于降低器件中的暗电流。

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