Investigation of Scallops of Narrow Microchannels in Deep RIE Process Using Mixtures of SF6/O2/C4F8 Gases

摘要

Based on inductively coupled plasma (ICP) system and deep RIE process,we have selected the narrow microchannels etched within width of 2 microns, used mixtures of SF6,O2 and C4F8 gases as a plasma etching, and studied the main process parameters on the influence of the scallops and etch rate.