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Monolithic integration of thermally stable enhancement-mode and depletion-mode InAlAs/InGaAs/InP HEMTs utilizing Ir-gate and Ag-ohmic contact technologies

机译:热稳定增强模式的单片集成和耗尽模式Inalas / InGaAs / InP Hemts利用IR-Gate和Ag-ohmic接触技术

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This paper reports a newly developed fabrication process for monolithic integration of thermally stable InAlAs/InGaAs/InP E/D-HEMTs based on Ir-gate and Ag-ohmic contact technologies. The Ir-gate and Ag-ohmic contacts were annealed simultaneously after passivation using a SiN{sub}x layer. Both integrated E/D-HEMTs with gate-length of 0.2μm demonstrated excellent DC and RF characteristics.
机译:本文报道了一种新开发的制造过程,用于基于IR-Gate和Ag-ohmic接触技术的热稳定Inalas / InGaAs / InP E / D-HEMT的单片集成。使用SIN {SUB} X层钝化后同时退火IR栅极和AG-OHMIC触点。栅极长度为0.2μm的集成e / d-hemts都证明了优异的DC和RF特性。

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