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Structure and a method for monolithic integration of HBT, depletion-mode HEMT and enhancement-mode HEMT on the same substrate

机译:HBT,耗尽型HEMT和增强型HEMT的单片集成的结构和方法

摘要

An epitaxial layers structure and a method for fabricating HBTs and HEMTs on a common substrate are disclosed. The epitaxial layers comprise generally a set of HBT layers on the top of a set of HEMT layers. The method can be used to fabricate HBT, E-mode HEMT and D-mode HEMT as well as passive devices, that enabling monolithic integration of a significant number of devices on a common substrate by a cost-effective way.
机译:公开了一种外延层结构以及用于在公共基板上制造HBT和HEMT的方法。外延层通常在一组HEMT层的顶部上包​​括一组HBT层。该方法可用于制造HBT,E模式HEMT和D模式HEMT以及无源器件,从而能够以经济高效的方式将大量器件单片集成在一个公共基板上。

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