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Post-CMOS MEMS Capacitive Pressure Sensor: Porous ALD Membrane for Sacrificial Layer Release and Diaphragm Sealing

机译:CMOS MEMS电容式压力传感器:多孔ALD膜用于牺牲层释放和隔膜密封

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In this work a nanoporous ALD composite layer is used as an intermediate membrane in order to support the releasing and sealing of diaphragms for the fabrication of absolute capacitive pressure sensor MEMS on top of a CMOS substrate. The nanoporous properties are achieved due to the principle of island growth which occurs at small numbers of ALD cycles. By alternately applying less than 10 ALD cycles for Al_2O_3 and ZnO, a homogeneous composite is achieved instead of a stack of Al_2O_3 and ZnO nanolaminates. Exposing the ALD composite layer to vapour phase HF/H_2O (vHF/H_2O) mixture, the ZnO is selectively texture-etched and an etch-resistant membrane remained, while the sacrificial layer is etched simultaneously. Further, the remaining ALD composite layer successfully prevents deposition of the sealing layer inside the cavity. Thus the principle suitability of a porous ALD composite layer for the sacrificial layer release and sealing of diaphragms is successfully demonstrated.
机译:在该工作中,纳米孔ALD复合层用作中间膜,以支撑隔膜的释放和密封,以在CMOS基板的顶部制造绝对电容压力传感器MEM。由于岛生长的原理,纳米多孔物质是在少量的ALD循环中发生的。通过交替施加少于10个ALD AL_2O_3和ZnO的ALD循环,实现了均匀的复合材料,而不是一堆Al_2O_3和ZnO纳米胺。将ALD复合层暴露于气相HF / H_2O(VHF / H_2O)混合物中,选择性地纹理蚀刻ZnO,静置耐蚀刻膜同时蚀刻牺牲层。此外,剩余的ALD复合层成功地防止了腔内的密封层的沉积。因此,成功地证明了用于牺牲层释放和隔膜密封的多孔ALD复合层的原理适用性。

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