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Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging

机译:具有用于MEMS封装的新型纳米结构电互连的耐氧结构LTCC基板

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In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously.
机译:在该研究中,提出了通过使用新颖的纳米结构金提供电连接包装来提供巧妙的阳极可粘合的LTCC(低温COFIRED陶瓷)基板。 开发了片上MEMS兼容纳米多孔金(NPG)的制造,其多孔结构提供海绵状功能,在阳极粘合期间也形成电触点。 MEMS集成的Si衬底通过阳极键合地机械地密封到金属馈通LTCC衬底,并且其电连接通过纳米多孔结构焊盘同时形成。

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