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Improved Clival Gate 4H-SiC MESFET with Recessed Drain Drift Region and Recessed P-Buffer Layer

机译:改进了具有凹陷漏极漂移区和凹陷的P缓冲层的栅极栅极4H-SiC MESFET

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An improved clival gate 4H-SiC MESFET with recessed drain drift region and recessed p-buffer layer (RDRP-CG MESFET) was proposed in this paper. The key improvement in this paper is the enhancement of the drain current and the breakdown voltage. The recessed drain drift region and recessed p-buffer layer are introduced in the proposed structure to ensure the rise of the drain current and the breakdown voltage simultaneously. DC and RF characteristics are simulated and compared to the clival gate 4H-SiC MESFET (CG MESFET). The numerical simulated results show that the breakdown voltage is 116.3V compared to 76.6V of CG MESFET, which is about 51.8% larger than that of CG MESFET. There is an 11.9% increase in drain saturation current of RDRP-CG MESFET compared with CG MESFET. Thus, the maximum output power density is about 70% larger than that of CG MESFET, which is due to the increase in drain saturation current and breakdown voltage. There is a slight decrease in cut-off frequency in the proposed structure.
机译:本文提出了一种具有凹陷漏极漂移区和凹陷的P-缓冲层(RDRP-CG MESFET)的改进的夹持栅极4H-SiC MESFET。本文的关键改进是增强漏极电流和击穿电压。在所提出的结构中引入凹进的漏极漂移区和凹陷的P缓冲层,以同时确保漏极电流和击穿电压的上升。模拟DC和RF特性,并与Clival栅极4H-SiC MESFET(CG MESFET)进行比较。数值模拟结果表明,击穿电压为116.3V,而CG MESFET的76.6V比为CG MESFET的约51.8%。与CG MESFET相比,RDRP-CG MESFET的排水饱和电流增加11.9%。因此,最大输出功率密度大于CG MESFET的70%,这是由于漏极饱和电流和击穿电压的增加。在所提出的结构中,截止频率略有下降。

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