Flex Based Embedded Die Packaging: 3D System in Packages for Medical Electronics Miniaturization - (PPT)

摘要

Embedding of active die and passives into the substrate is a good approach to 3-D connectivity; 1. Enables significant form factor reduction 2. Volume reductions of 50% or greater are typical 3. Area reductions of 30% or greater also are typical A control module was successfully designed, built, and passed MSL-3, TCB 1000 Cycles and uBiased HAST; Embedded die technologies will continue to gain in acceptance in the marketplace across a broad range of emerging applications.