首页> 外国专利> System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

机译:将无线通信设备嵌入到半导体封装中的系统和方法,包括芯片级封装和3D半导体封装

摘要

A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be affixed to a package lid of the microelectronic device. The wireless tag may further be affixed to a chip scale package or a three dimensional semiconductor package. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.
机译:无线标签包括全部形成在薄膜基板上的无线收发器,存储器和天线。无线标签被插入微电子设备的包装材料中以实现跟踪和认证功能。在一些实施例中,无线通信设备存储微电子设备和/或并入微电子设备的派生系统产品的身份或其他标识信息。可以将无线标签粘贴到微电子设备的包装盖上。无线标签可以进一步被粘贴到芯片级封装或三维半导体封装上。以这种方式,无线通信设备可以用于跟踪和认证微电子设备以及结合了微电子设备的派生系统产品。

著录项

  • 公开/公告号US2011168786A1

    专利类型

  • 公开/公告日2011-07-14

    原文格式PDF

  • 申请/专利权人 CHANG-MING LIN;

    申请/专利号US20100977050

  • 发明设计人 CHANG-MING LIN;

    申请日2010-12-22

  • 分类号G06K19/077;H01L21/50;

  • 国家 US

  • 入库时间 2022-08-21 18:16:09

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