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System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
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机译:将无线通信设备嵌入到半导体封装中的系统和方法,包括芯片级封装和3D半导体封装
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摘要
A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be affixed to a package lid of the microelectronic device. The wireless tag may further be affixed to a chip scale package or a three dimensional semiconductor package. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.
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