Pattern Transfer of 23-nm-Diameter Block Copolymer Self-Assembled Nanodots Using CF_4 Etching with Carbon Hard Mask (CHM) as Mask

摘要

The self-assembly of block copolymer (BCP) has demonstrated as promising alternative technology to overcome the limitation of conventional lithography owing to its ability in forming nanostructure with size 3-100 nm. In this study, we investigated a technique to transfer self-assembled nanodots of Poly (styrene-b-dimethyl siloxane) (PS-PDMS) BCP to Si. The pattern transfer of PS-PDMS nanodots with the pitch of 33 nm and the diameter of 23 nm using CF_4 etching with Carbon Hard Mask (CHM) as mask is demonstrated. Si nanopillar with height of 51 nm was fabricated. This result improves the potential use of PS-PDMS BCP self-assembly technique for fabrication nano-electronic devices, such as quantum dot solar cell and ultrahigh density of magnetic recording.