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Characteristics of 4H-SiC RF MOSFETs on a Semi-insulating Substrate

机译:半绝缘基板上的4H-SiC RF MOSFET的特性

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摘要

This study has provided considerable insight into the impact of device down scaling on the characteristics of RF devices. This type of RF devices, featuring a thin p-layer based on a semi-insulating substrate, is free from the unwanted parasitic effects resulting from traditional conducting substrates. We fabricated 4H-SiC RF MOSFETs with f_T/f_(MAX) of 0.7/1.5 GHz and, in so doing, identified the key issues associated with short channel effects, influencing device mobility and the RF characteristics of RF MOSFETs on a semi-insulating substrate.
机译:本研究提供了相当大的洞察设备对RF器件特性的影响。这种类型的RF器件,具有基于半绝缘基板的薄P型,不含传统导电基材所产生的不需要的寄生效应。我们用0.7 / 1.5 GHz的F_T / F_(MAX)制造了4H-SIC RF MOSFET,在此操作中,确定了与短信效应相关的关键问题,影响RF MOSFET的射频MOSFET在半绝缘中的关键问题基质。

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