首页> 外文会议>International Conference on Micro- and Nano-Electronics >OPTIMIZATION OF NEAR-SURFICIAL ANNEALING FOR DECREASING OF DEPTH OF P-N-JUNCTION IN SEMICONDUCTOR HETEROSTRUCTURE
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OPTIMIZATION OF NEAR-SURFICIAL ANNEALING FOR DECREASING OF DEPTH OF P-N-JUNCTION IN SEMICONDUCTOR HETEROSTRUCTURE

机译:近曲面退火的优化近表面退火,降低半导体异质结构中P-N结的深度

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In this paper analysis of dopant redistribution during formation of p-n-junction in semiconductor heterostructure by laser or microwave annealing has been done. It has been shown, that inhomogeneity of the heterostructure after annealing with appropriate duration leads to simultaneously increasing of sharpness of p-n-junction and homogeneity of dopant distribution in doped area. Inhomogeneity of temperature distribution leads to simultaneously increasing of both effects. Some conditions on properties of doped heterostructure and annealing time for simultaneously increasing of sharpness ofp-n-junction and homogeneity of dopant distribution in doped area are formulated.
机译:在通过激光或微波退火的形成期间,通过激光或微波退火形成掺杂期间的掺杂剂再分配的掺杂剂再分分析。已经表明,通过适当持续时间退火后异质结构的不均匀性导致同时增加掺杂区域的掺杂剂分布的p-n结和均匀性的锐度。温度分布的不均匀性导致同时增加两种效果。制定了一些关于掺杂异质结构和退火时间的条件,同时增加掺杂区域掺杂区域的P-N结锐度和掺杂剂分布的均匀性。

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