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首页> 外文期刊>Applied Nanoscience >Using serial radiation processing and microwave annealing decreases depth of p–n junction in a semiconductor heterostructure
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Using serial radiation processing and microwave annealing decreases depth of p–n junction in a semiconductor heterostructure

机译:使用串行辐射处理和微波退火可减小半导体异质结构中p–n结的深度

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It has recently been shown that manufacturing of diffusive-junction rectifiers and implanted-junction rectifiers in a semiconductor heterostructure after appropriate choosing of parameters of the structure and optimization of annealing time leads to increase of the sharpness of p – n junction and at one time to increase the homogeneity of dopant distribution in doped area. Formation of inhomogeneity of temperature in the heterostructure by laser or microwave annealing gives us possibility to increase the both effects at one time. It has recently been shown by experiments that predoping radiation processing of materials leads to changing of dopant diffusion in comparison with nonprocessed one. In this paper, we consider the possibility to use serial radiation processing of materials of heterostructure before doping and microwave annealing of radiation defects after doping to increase the sharpness p – n junctions and at one time to increase the homogeneity of dopant distribution in doped area in the heterostructure.
机译:最近已经表明,制造扩散结整流器和注入结整流器的在后的结构的参数的适当选择和退火时间导致增加p的锐度的优化的半导体异质结构 - n结并在同一时间,以增加掺杂区中掺杂剂分布的均匀性。通过激光或微波退火在异质结构中形成温度不均匀性使我们有可能同时增加两种作用。最近通过实验表明,与未处理的材料相比,预掺杂材料的辐射处理会导致掺杂剂扩散的变化。在本文中,我们考虑了在掺杂之前使用异质结构材料进行连续辐射处理以及在掺杂之后对辐射缺陷进行微波退火的可能性,以提高p-n结的清晰度,并一次提高掺杂区中掺杂剂分布的均匀性。异质结构。

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