Wafer Level Packaging (WLP) by Transfer Molding

摘要

Encapsulation of wafer scale packages is a challenge. Compression molding (placing a wafer in a compound bath) is a good candidate to achieve this, but also transfer molding is an interesting technique to perform wafer level molding. Transfer Molding (a compound flow covers the wafer from beginning to end) is a well-known and long standing technique which has proven to be very reliable and suitable for mass-production because of it's low yield loss. In the project "David" (http://www.david-project.eu/), Fico cooperates with European partners to show the capabilities of wafer level transfer molding. The goal for Fico was to encapsulate a wafer with low pressure during filling and a low defection (bending of the substrate) after molding.