WLP HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING WLP

摘要

Some novel features relate to a first example of providing a semiconductor device comprising a printed circuit board (PCB), a set of solder balls and a die. The PCB comprises a first metal layer. A set of solder balls is coupled to the PCB. The die is coupled to the PCB via a set of solder balls. The die comprises a second metal layer and a third metal layer. The first metal layer of the PCB, the set of solder balls, the second metal layer of the die, and the third metal layer are configured to act as an inductor in a semiconductor device. In some implementations, the die further includes a passivation layer. The passivation layer is positioned between the second metal layer and the third metal layer. In some implementations, a second metal layer is positioned between the passivation layer and a set of solder balls.