high quality factor inductor implemented in wafer level packaging (wlp)

摘要

1/1 summary "High quality factor inductor implemented in wafer level packaging (wlp)" Some novelty features belong to a first example that provides a semiconductor device that includes a printed circuit board (pcb), solder balls and an array. The PCB includes a first metallic layer. The solder ball assembly is coupled to the PCB. the matrix is coupled to a second metallic layer and a third metallic layer. The first metal layer of the PCB, the solder ball assembly, the second and third metal layers of the matrix are configured to operate as an inductor in the semiconductor device. In some implementations, the matrix additionally includes a passivation layer. The passivation layer is positioned between the second metallic layer and the third metallic layer. In some implementations, the second metal layer is positioned between the passivation layer and the solder ball assembly.