Via (Plated Through Hole) Integrity with Lead Free Soldering

摘要

Bare printed wiring board materials require changes from today's typical standard dicy cured FR4 materials in order to support lead-free assembly. The High Density Packaging User's Group has completed a study of via reliability through air-to-air thermal cycling after various SnPb and lead-free reflow profiles. Six different materials, with different numbers of reflow profiles were studied in this test through 6000 accelerated thermal cycles. Data from this testing will be presented that clearly shows that all materials claimed to be lead-free compatible are not created equal. A review of relevant material properties vs. the results will also be attempted.