Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

摘要

Increased packaging demands in wireless communications, and military electronics has led to the use of flip-chips for RF and microwave applications. For a reliable bonding of flip-chip interconnection, proper knowledge of bonding parameters and bonding ability to different substrates is important. This paper depicts a comparative analysis of flip-chip bonding of GaAs MMIC (Monolithic Microwave Integrated Circuit) to thick/thin film metallization on ceramic substrates (hereinafter thick-film and thin-film), and organic substrates using Anisotropic Conductive Film (ACF), Thermo-compression (TC) bonding methods with different bonding parameters. The results from the optimization study of the parameter settings for mechanical reliability of ACF and TC with different substrates are presented.