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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

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1.An Improved Method of Endpoints Detection Based on Energy-Frequency-Value

机译：基于能量频率值的端点检测方法改进方法
- 作者：Chen Guanghua;Liu Junhai;Ye Jun
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
2.Failure Analysis of the CdZnTe Detector Electrode Contacts

机译：CDZNTE检测器电极触点的故障分析
- 作者：Teng Jianyong;Sang Wenbin;Qin Kaifeng;Min Jiahua;Xia Jun
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
3.Design and Implementation of a High Efficient Power Converter for self-powered UHF RFID Applications

机译：用于自动UHF RFID应用的高效功率转换器的设计与实现
- 作者：Cairong Chen;Majid Baghaei Nejad;Li-Rong Zheng
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
4.Effect of bonding parameters on thermosonic flip chip bonding under pressure constraint pattern

机译：压力约束图案中粘接参数对热循环倒装芯片粘接的影响
- 作者：Fuliang WANG;Junhui LI;Lei HAN;Jue ZHONG
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
5.Checking Causality of Interconnects through Minimum-phase and All-pass Decomposition

机译：通过最小相位和全通分解检查互连的因果关系
- 作者：Bao Shu Xu;Xiang Yin Zeng;Jiangqi He;Dong-ho Han
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
6.Integration of a 5-GHz radio front-end in PCB

机译：在PCB中集成了5-GHz无线电前端
- 作者：Shaofang Gong;Anders Backstrom;Mats Agesjo;Adriana Serban;Magnus Karlsson
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
7.A Comprehensive Finite Element Model for Simulating Reflow Profile of a BGA Package

机译：用于模拟BGA封装回流谱的综合有限元模型
- 作者：SHEN Liang;WANG Mingxiang;HE YongHong;LAM Tim Fai;JIANG YuQi
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
8.High Thermally Conductive and High Reliability Under-fill

机译：填充高导热和高可靠性
- 作者：Yukinari ABE;Kazuyoshi YAMADA;Nobuyuki ABE;Fumio TANAKA;Tatsuhiro FUJIKI
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
9.Studies on Design, Fabrication and Reliability Assessment of Embedded Passives on a High-Density Interconnect (HDI) Organic Substrate using a Sequential Build-Up Process

机译：使用顺序堆积过程研究高密度互连（HDI）有机基质嵌入式的设计，制备和可靠性评估
- 作者：Mahesh G. Varadarajan;Kang J. Lee;Swapan K. Bhattacharya;Ajanta Bhattacharjee;Lixi Wan;Raghuram Pucha;Rao R. Tummala;Suresh Sitaraman
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- Embedded capacitor;
- Embedded PWB fabrication;
- Thermo-mechanical reliabili embedded passives;
10.Hybrid Interconnects Using Silicon/FR-4 Substrates for Board-Level 10 Gb/s Signal Broadcasting

机译：混合互连使用用于板级10 GB / S信号广播的硅/ FR-4基板
- 作者：Yin-Jung Chang;Daniel Guidotti;Lixi Wan;Gee-Kung Chang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
11.Research on manufacturing execution system for the SMT industry

机译：SMT产业制造执行系统研究
- 作者：Chen Dongfan;Zhou Lincan
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
12.Role of Cu Contents in the Isothermal Metallurgical Reaction for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Joints with Cu/Electroless Ni-P/Immersion Au Bonding Pad during Aging

机译：Cu含量在倒装芯片Sn-3.0Ag-（0.5或1.5）Cu接头的等温冶金反应中的作用在老化期间用Cu / Collectoless Ni-P /浸没Au键合垫
- 作者：Guh-Yaw Jang;Jenq-Gong Duh;Su-Yueh Tsai;Chi-Rung Lee
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
13.Design for Embedded Chinese Display Smart Card

机译：嵌入式中文显示智能卡的设计
- 作者：Hua Zhou;Yang Liu;Dimitar Antonov Kolev;Jingjing Chen;Zonghe Lai;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
14.Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging

机译：基于微息理论在微基波理论下微型系统互连层的均质化模型
- 作者：Yan Zhang;Ragnar Larsson;Jing-yu Fan;Zhaonian Cheng;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
15.Design and Modeling Challenges for High Density Packaging

机译：高密度包装设计与建模挑战
- 作者：Chris Bailey
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
16.Development and Prototyping of a HB-LED Array Module for Indoor Solid State Lighting

机译：用于室内固态照明的HB-LED阵列模块的开发和原型
- 作者：S. W. Ricky LEE;C. H. LAU;S. P. CHAN;K. Y. MA;M. H. NG;Y. W. NG;K. H. LEE;Jeffery C. C. LO
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
17.Modeling and Reliability Analysis of Lead-Free Solder Joints of Bottom Leaded Plastic (BLP) Package

机译：底部铅塑料（BLP）包装无铅焊点的建模与可靠性分析
- 作者：Chen Xiangyang;Zhou Dejian
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
18.Effects of Thermosonic Bonding Parameters on Flip Chip LEDs

机译：热循环参数对倒装芯片LED的影响
- 作者：Kun Zhao;Lei Jia;Jian Duan;Jianhua Zhang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
19.Nanopackaging: Nanotechnologies and Electronics Packaging

机译：Nanopachaging：纳米技术和电子包装
- 作者：James E. Morris
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
20.Reliability of fine pitch Sn-3.8Ag-0.7Cu flip chip solder joints with different connection pads

机译：细间距SN-3.8AG-0.7CU倒装芯片焊点的可靠性，具有不同的连接垫
- 作者：Dezhi Li;Changqing Liu;Paul P. Conway
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
21.Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

机译：在回流焊接后，在Sn-Co-Cu，Sn-Ag-Cu和共晶Sn-Cu焊点中的金属间化合物形成在化学镜（P）浸没Au表面饰面
- 作者：Peng Sun;Cristina Andersson;Xicheng Wei;Zhaonian Cheng;Dongkai Shangguan;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
22.Effect of Bonding Pressure on Transducer Ultrasonic Propagation in Thermosonic Flip Chip Bonding

机译：粘接压力对热循环倒装芯片粘接中换能器超声波沟的影响
- 作者：Long Zhili;Han Lei;Wu Yunxin;Zhong Jue
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
23.Silver migration control in Electrically Conductive Adhesives

机译：导电粘合剂中的银迁移控制
- 作者：Yi Li;C. P. Wong
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
24.Nonlinear Behaviors of Transducer Dynamics for Thermosonic Bonding

机译：热循环键合换能器动力学的非线性行为
- 作者：Lei Han;Jue Zhong
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- PZT transducer assembly;
- Nonlinear dynamics;
- Thermosonic bonding;
- Experimental studies;
- Laser Doppler vibrometer;
25.Design and Development of Thermal-Mechanical Solutions for a Community Personal Computer

机译：社区个人计算机的热机械解决方案的设计与开发
- 作者：David Zhou;Tze Yang Hin;Keat Ghee Tan;Boon Howe Oh
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
26.System-on-Flexible-Substrates: Electronics for Future Smart-Intelligent World

机译：柔性基板：未来智能智能世界的电子产品
- 作者：Li-Rong Zheng;Majid B. Nejad;Saul Rodriguez;Lu Zhang;Cairong Chen;Hannu Tenhunen
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
27.Overview of Recent Advances on Isotropic Conductive Adhesives

机译：各向同性导电粘合剂近期进步概述
- 作者：Daoqiang Daniel Lu;C. P. Wong
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
28.Newly Developed LCP Solvent Casting Film and Its Applications

机译：新开发的LCP溶剂铸造膜及其应用
- 作者：Satoshi Okamoto
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
29.High-Speed Board-To-Board Interconnects Utilizing Flexible Foils and Elastomeric Connectors

机译：利用柔性箔和弹性形式连接器的高速板到板互连
- 作者：Allan Huynh;Par Hakansson;Shaofang Gong;Leif Odselius
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
30.Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC

机译：GaAs MMIC倒装芯片粘接机械强度分析
- 作者：Bo Zhang;Vignesh Murugesan;Niklas Billstrom;Patrik Stenquist;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
31.Design of an Architecture for Multiprocessor System-on-Chip (MPSoC)

机译：多处理器系统（MPSOC）的架构设计
- 作者：Hu Yue-li;Ding Qian
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
32.Architecture Research and VLSI Implementation for Discrete Wavelet Packet Transform

机译：用于离散小波包变换的建筑研究和VLSI实现
- 作者：Xu Mei-hua;Chen Zhang-jin;Ran Feng;Cheng Yu-lan
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- Frame-partitioned architecture;
- Same address operation;
- FPGA simulation;
- Wavelet packet transform;
33.A Novel Structure for CdZnTe Capacitive Frisch Grid Radiation Detector

机译：CDZNTE电容式FRISCH电网辐射检测器的新颖结构
- 作者：Qian Yongbiao;Sang Wenbin;Xia Jun;Min Jiahua;Teng Jianyong;Liang Xiaoyan
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
34.Low Cost Smart Labels Assembled by Anisotropically Conductive Adhesive

机译：通过各向异性导电粘合剂组装低成本智能标签
- 作者：An Bing;Chu Hua-bin;He Jing-qiang;Wang Jia;Hua Li;Wu Feng-Shun;Wu Yi-ping
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
35.A Low-Voltage Bandgap Reference with Resistive Subdivision

机译：具有电阻细分的低压带隙参考
- 作者：Xu Xing;Wang Xichuan;Si Cuiying
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- Bandgap reference;
- Low supply voltage;
- PSRR;
- CMOS;
36.Curvature-Compensated CMOS Bandgap Reference with 1.8-V Operation

机译：曲率补偿CMOS带隙参考，具有1.8V操作
- 作者：Wang Xichuan;Si Cuiying;Xu Xing
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
37.Modeling and identification of a sub-mini helicopter

机译：子迷你直升机的建模与识别
- 作者：Liang Liu;Weilong Zheng;Li Chen
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- Sub-mini helicopter;
- Physical models;
- Subspace;
- System identification;
38.The Effect of Accelerated Thermal Cycle Parameters and The Geometry Dimensions on Solder Joint Reliability

机译：加速热循环参数的影响及几何尺寸对焊点可靠性的影响
- 作者：Bingting Hu;Jiemin Zhou;Ping Zhou;Ying Yang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
39.RF Characterization of Flip-Chip Anisotropic Conductive Adhesives Joints

机译：倒装片各向异性导电粘合剂接头的RF表征
- 作者：Xu Wang;Zhaonian Cheng;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
40.Studies of Electrical Characteristics of Wire Bonder Transducer by Clamp Condition and On/Off of Bonding Tool

机译：夹紧工具及粘接工具电纤维换能器电气特性研究
- 作者：Guang Mingan;Han Lei;Li Hanxiong
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
41.Experimental Studies on Bonding Pressure in Wire Bonding

机译：引线键合中粘合压力的实验研究
- 作者：Rongzhi Gao;Lei Han;Jue Zhong
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
42.An Innovative Fully Printable RFID Technology Based on High Speed Time-Domain Reflections

机译：基于高速时域反射的创新完全可打印的RFID技术
- 作者：Lu Zhang;Saul Rodriguez;Hannu Tenhunen;Li-Rong Zheng
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
43.On the Heat Transfer Enhancement Based on Micro-Scale Air Impinging Jets with Microstructure Heat Sink in Electronics Cooling

机译：基于微级空气撞击射流的传热增强在电子冷却中微观结构散热器的微级空气
- 作者：Jing-yu Fan;Yan Zhang;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
44.Tin Whisker Growth under Cycling Current Pulse

机译：循环电流脉冲下的罐晶须生长
- 作者：Bo Jiang;Ai-Ping Xian
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
45.The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment

机译：用于光纤焊接过程中Au / Ti和Au / Ni金属化的共晶Au-Sn和Sn-Sn焊料的微观结构
- 作者：Yan Bohan;Wang Chunqing;Zhang Wei
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
46.Experimental Optimization of Process Parameters for Diode Laser Soldering of BGA

机译：BGA二极管激光焊接工艺参数的实验优化
- 作者：Yulin Wang;Zhenhua Xiong;Xinjue Zou;Han Ding
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
47.Cooling Challenges and Best Practices for High Density Data and Telecommunication Centers

机译：冷却挑战和高密度数据和电信中心的最佳实践
- 作者：David Wang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
48.Laser Soldering System Calibration Based on Computer Vision

机译：基于计算机视觉的激光焊接系统校准
- 作者：Xinjue Zou;Zhenhua Xiong;Yulin Wang;Han Ding
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
49.IC Fillet-lifting Mechanism on Wave Soldering after Reflow Soldering

机译：回流焊接后波焊的IC圆角升降机制
- 作者：Goro IZUTA;Tsuyoshi TANABE;Junichi MURAI;Masaaki MURAKAMI;Katsuaki SUGANUMA
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
50.Motherboard Heat Transfer Modeling Methodology

机译：主板传热建模方法
- 作者：Kar Mun Ng;Ketan R. Shah
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
51.Lead Free Solder Bump manufacturing with IBM's C4NP Process

机译：带有IBM的C4NP工艺的无铅焊料凸块制造
- 作者：Eric Laine;Klaus Ruhmer;Eric Perfecto;Hai Longworth;David Hawken
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
52.Low Cycle Fatigue of Sn-based Lead-free Solder Joints and the Analysis of Fatigue Life Prediction Uncertainty

机译：基于Sn的无铅焊点的低循环疲劳和疲劳寿命预测不确定性的分析
- 作者：Cristina Andersson;Peng Sun;Johan Liu
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
53.The Growth Behavior of Intermetallic Compound Layers of Sn-3Ag/Cu and Sn/Cu Joints during Soldering and Aging

机译：焊接期间Sn-3Ag / Cu和Sn / Cu接头的金属间化合物层的生长行为
- 作者：Cong-qian Cheng;Peng Yang;Jie Zhao;Feng Zhu;Qing-Yang Song
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
54.Design of an Embedded On-Chip Debug Support Module of a MCU

机译：MCU的嵌入式片上调试支持模块的设计
- 作者：Hu Yue-li;Xiong Bing
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
55.Effect of Bi on the Kinetics of Intermetallics Growth in Sn-3Ag-0.5Cu/Cu Solder Joint

机译：BI对SN-3AG-0.5CU / Cu焊点金属间化合物生长动力学的影响
- 作者：Jie Zhao;Lin Qi;Lai Wang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
56.Study of assembling ZnO nanowires on AFM tips

机译：AFM提示ZnO纳米线组装的研究
- 作者：Hu Siyan;Sang Wenbin;Zhu Zhenghui;Wang Bin;Min Jiahua
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- ZnO nanowires;
- Atomic Force Microscope;
- Self-assembly;
57.Analysis and Application Performance Simulation of Subband Adaptive filtering structures

机译：子带自适应滤波结构的分析与应用性能模拟
- 作者：Chen Guanghua;Ye Jun;Liu Junhai
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
58.Experimental Research on Compulsive Cooling of Swirling Jet Impingement

机译：旋转喷射冲击强迫冷却的实验研究
- 作者：Yifeng Fu;Jiemin Zhou;Ying Yang
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
- Swirling jet impingement;
- Heat transfer;
- Nusselt number;
- Compulsive cooling;
- Electronic packaging;
59.Simulation design of capacitive Frisch grid CdZnTe detectors

机译：电容式FRISCH电容CDZNTE探测器的仿真设计
- 作者：Xia Jun;Sang Wenbin;Qian Yongbiao;Min Jiahua;Teng Jianyong;Liang Xiaoyan
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
60.Experimental Identification of Parasitic Vibrations on Ultrasonic Bonding Transducer

机译：超声波粘接换能器寄生振动的实验鉴定
- 作者：Aijun Song;Han Lei;Han-Xiong Li
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
61.Computer Modeling of a Micro-manufactured One-turn Inductor

机译：计算机建模微制造的一圈电感器
- 作者：Hua Lu;David Flynn;Chris Bailey;Marc Desmulliez
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
62.Thermal Conductivity of Isotropic Conductive Adhesives Composed of An Epoxy-Based Binder

机译：各向同性导电粘合剂的热导率由环氧基粘合剂组成
- 作者：Masahiro Inoue;Hiroaki Muta;Takuji Maekawa;Shinsuke Yamanaka;Katsuaki Suganuma
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年
63.Fracture Surface Analysis of Aged and Drop Tested Sn-Ag-Cu Solder Joints

机译：老化和掉落测试Sn-Ag-Cu焊点的断裂表面分析
- 作者：E. F. Monlevade;T. Reinikainen
- 会议名称：《Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》 | 2006年