Study of Flip-Chip Bump Interconnection in M-Wave GaAs MMIC

摘要

The flip-chip bump interconnection structure has become popular for packaging of microwave and Millimeter (MM)-wave applications. The structure is expected to provide a higher-performance and lower-cost packaging method. This paper presents the results of an evaluation of flip-chip assembled RF devices. A co-planer line type GaAs MMIC (Monolithic Microwave IC) was mounted on an Al_2O_3 substrate using the flip-chip bump interconnection method, And the electrical performance (S-parameter) was measured and the reliability of the interconnection Was tested.