The microelectronic industry has been putting efforts to eliminate lead (Pb) from the products and related manufacturing processes in order to meet the EU RoHS Directive. Numerous studies on lead-free interconnect reliability have been published and more will be available in the near future. It is difficult to draw some general conclusions without looking at those available data from a higher level. Therefore it is critical for packaging reliability engineers to look retrospectively from time to time on what have been done see if any gaps need to be filled and covered. The purpose of this study is to do such statistical analysis on current available Pb-Free package reliability data to 1) sort out the most significant attributes for Pb-Free solder joint fatigue life and establish a simple predictive model, and 2) check on the areas that need to be paid more attention down the road in the future.
展开▼
