LARGE AREA ARRAY PACKAGE LEAD-FREE REWORK STUDY

摘要

Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of electronic components. The HDPUG Consortium conducted a study on the time / temperature profile for reflow for the rework process. The rework of these component types will be evaluated and the key issues such as reflow profiling, adjacent component temperatures, and solder joint formation will be discussed. Results of metallurgical analysis are given to support the success of the process used. These were subsequently used for the build of the GPLF (General Purpose Lead Free) test vehicle to assess reliability of Sn/Ag/Cu solder joints produced.