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Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging

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1.PROCESS CHARACTERIZATION OF THE 01005 (ENGLISH) COMPONENT PACKAGE

机译：01005（英语）组件包的过程表征
- 作者：Tom Borkes;Lawrence Groves
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
2.ASSESSING THE RELIABILITY OF AREA ARRAY CONNECTORS

机译：评估区域阵列连接器的可靠性
- 作者：Heather McCormick;George Riccitelli
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- BGA Connectors;
- BGA socket;
3.RELIABILITY STUDY AND SOLDER JOINT MICROSTRUCTURE OF VARIOUS SnAgCu CERAMIC BALL GRID ARRAY (CBGA) GEOMETRIES AND ALLOYS

机译：各种SnAGCU陶瓷球栅阵列（CBGA）几何形状和合金的可靠性研究和焊接关节微观结构
- 作者：Marie Cole;Matthew Kelly;Mario Interrante;Gregory Martin;Christian Bergeron;Mukta Farooq;Mark Hoffmeyer;Simin Bagheri;Polina Snugovsky;Zohreh Bagheri;Marianne Romansky
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SAC CBGA;
- SnAgCu CBGA;
- mixed assembly;
4.EMERGING OPPORTUNITIES AND CHALLENGES FOR HIGH FREQUENCY BROADBAND COMMUNICATIONS

机译：高频宽带通信的新兴机遇和挑战
- 作者：Rudy Emrick;Steve Franson;John Holmes;Bruce Bosco;Steve Rockwell
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
5.REWORK SYSTEM-TO-SYSTEM PERFORMANCE CHARACTERIZATION

机译：返工系统到系统性能表征
- 作者：Al Cabral
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- rework;
- repair;
- performance;
- matching;
6.LARGE AREA ARRAY PACKAGE LEAD-FREE REWORK STUDY

机译：大型区域阵列包装无铅返工研究
- 作者：David Geiger;Damone Phanavong;Todd Castello;Dongkai Shangguan
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- lead-free;
- SnAgCu alloy;
- rework;
- area-array;
7.EMS ACQUISITION INTEGRATION – CREATING OPERATIONAL SYNERGY WHILE STAYING ALIGNED WITH ACQUIRED CUSTOMER EXPECTATIONS

机译：EMS采集集成 - 创建运营协同作用，同时保持与获得的客户期望保持一致
- 作者：Todd M. Baggett
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
8.A UNIQUE PROCESS THAT ELIMINATES SOLDER DROSS

机译：一个独特的过程，消除了焊料渣滓
- 作者：Daniel (Baer) Feinberg;P. Kay Metal;Fein-Line Associates
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
9.A STUDY OF COPPER DISSOLUTION IN Pb-FREE SOLDER FOUNTAIN SYSTEMS

机译：无铅焊料喷泉系统中的铜溶解研究
- 作者：Fritz Byle;Denis Jean;Dale Lee
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
10.CONNECTING THE UNCONNECTED - BROADBAND WIRELESS ACCESS TECHNOLOGIES AND NETWORK

机译：连接未连接的 - 宽带无线接入技术和网络
- 作者：Xin Meng
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
11.EFFECT OF INERT ATMOSPHERE REFLOW AND SOLDER PASTE VOLUME ON THE MICROSTRUCTURE AND MECHANICAL STRENGTH OF MIXED Sn-Ag-Cu AND Sn-Pb SOLDER JOINTS

机译：惰性气氛回流和焊膏体积对混合Sn-Ag-Cu和Sn-Pb焊点的微观结构和机械强度的影响
- 作者：Mulugeta Abtew;Robert Kinyanjui;Narong Nuchsupap;Thanarkhom Chavasiri;Net-Hin Yingyod;Paiboon Saetang;Jakrit Krapun;Kriangsak Jikratoke
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
12.RHEOLOGICAL EFFECTS IN UNDERFILL JET-DISPENSING

机译：底部填充喷射分配的流变效应
- 作者：Vinod Mohan;Paul Morganelli Ph.D.;Bryon Stevens;Brian Wheelock
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
13.EFECTIVE LEAN SIX SIGMA DEPOYMENT IN A GLOBAL ELECTRONICS MANUFACTURING SERVICES ENVIRONMENT

机译：在全球电子制造服务环境中有效瘦六西格玛部署
- 作者：Harjinder Ladhar
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
14.RoHS IMPLEMENTATION IN A CONTRACT ELECTRONICS MANUFACTURING ENVIRONMENT

机译：RoHS在合同电子制造环境中实施
- 作者：Amol S. Kane;Eric P. Griffen;D.L Santos Ph.D.
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- RoHS;
- WEEE;
- lead-free;
- Material Declarations;
- Moisture Sensitivity;
15.PROCESS CHARACTERIZATION FOR THE ASSEMBLY OF 01005 COMPONENTS

机译：01005组件组件的过程表征
- 作者：Ashok Viswanathan;Krishnaswami Srihari Ph.D.;Jeffrey D. Schake
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005 devices;
- Area Ratio;
- Passives;
- Transfer Efficiency;
16.PROCESS FOR BLIND MICROVIA FILLING AND THROUGH HOLE METALLIZATION OF HIGH DENSITY INTERCONNECTS

机译：盲微孔填充过程和高密度互连的空穴金属化
- 作者：Bob Gallant
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
17.LEAD-FREE HAND SOLDERING: NEW TECHNOLOGIES FOR ENHANCING THE WEAKEST LINK IN THE LEAD-FREE REWORK AND REPAIR PROCESS CONTROL CHAIN

机译：无铅手焊接：用于增强无铅返工和修理过程控制链中最薄弱联系的新技术
- 作者：Mark Cannon;Bob Klenke;Phil Zarrow
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
18.ENABLING HIGH DENSITY SYSTEM IN PACKAGE (SiP) MANUFACTURING AND CONSUMER ELECTRONIC DEVICES THROUGH THE USE OF JETTING TECHNOLOGY TO MINIMIZE SUBSTRATE AREA FOR UNDERFILL

机译：通过使用喷射技术使包装（SIP）制造和消费电子设备中的高密度系统能够最小化底部填充物的衬底区域
- 作者：Michael Peterson;Steven J. Adamson
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
19.SOLIDIFICATION BEHAVIOUR OF LEAD-FREE ALLOYS AND ITS RELATIONSHIP TO THEIR PERFORMANCE AS PRACTICAL SOLDERS

机译：无铅合金的凝固行为及其与实用焊料表现的关系
- 作者：Keith Sweatman;Tetsuro Nishimura
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free solders;
- solidification;
- eutectics;
20.FLIP CHIP INTEGRATION OF A LARGE FORMAT ARRAY OF MOEMS DEVICES FOR SPACE INFRARED ASTRONOMY

机译：空间红外天文学的MoEMS设备大格式阵列的倒装芯片集成
- 作者：Christine A. Allen;John Abrahams;Nick Costen;Larry Hess;Mary Li;Timothy Miller;S. Harvey Moseley;James Pontius;David Puckett;Eric Schulte;Christian Zincke
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- microshutter array;
- room temperature singlesided indium bump bonding;
- flip-chip bonding;
- MOEMS;
21.MATHEMATICAL MODELING OF SOLDER PASTE STENCILING FOR PROCESS CONTROL

机译：用于过程控制的焊膏施用的数学建模
- 作者：Tim Wright
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
22.RELIABILITY EVALUATION OF PLATED-THROUGH HOLES FOR HIGH DENSITY PWB APPLICATION

机译：高密度PWB应用镀孔孔的可靠性评估
- 作者：Donghyun Kim;Mudasir Ahmad;David Senk;Mason Hu;Sue Teng;Rocky Shih
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
23.A NEW ENVIRONMENTALLY BENIGN METHOD FOR LEAD-FREE SOLDER DEFLUXING

机译：一种新的无铅焊料除盖的环境良性方法
- 作者：Albert J. Mastrangelo;Susan Chute;Jay Soma;Robert Sell;Christine Fouts
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free;
- cleaning;
- vapor degreasing;
- cosolvent;
24.PRECISION COATING DEPOSITION TECHNIQUES FOR CONFORMAL COATING APPLICATIONS

机译：用于保形涂层应用的精密涂层沉积技术
- 作者：Stuart Erickson
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
25.FIRST ORDER FAILURE MODEL FOR LEADLESS CERAMIC CHIP DEVICES WITH PB-FREE SOLDER

机译：无铅陶瓷芯片装置的一级故障模型与PB无铅焊料
- 作者：Nathan Blattau;Craig Hillman
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- failure;
- model;
- analytical;
- fatigue;
- thermal cycling;
- resistor;
- SnAgCu;
- solder;
26.3D SYSTEM-IN-PACKAGAGE SOLUTION FOR MIXED IC TECHNOLOGY APPLICATIONS

机译：用于混合IC技术应用的3D系统内解决方案
- 作者：Vern Solberg
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- MicroContact;
- Chip-Scale;
- Stacked-die;
27.PROCESS DEVELOPMENT FOR 01005 LEAD-FREE PASSIVE ASSEMBLY: STENCIL PRINTING

机译：01005无铅无源组件的过程开发：模版印刷
- 作者：Joe Belmonte;Vatsal Shah;Rita Mohanty Ph.D.;Tim Jensen;Ron Lasky Ph.D.;Jeff Bishop
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005;
- passives;
- passive assembly;
- lead free passive assembly;
28.TIN PEST PHENOMENA: A REAL WORLD TEST SCENARIO

机译：锡虫现象：一个真实的世界考试情景
- 作者：David Hillman;Mike Schmidt;Bev Christian Ph.D.
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
29.FASTENING HARDWARE USING SURFACE MOUNT TECHNOLOGY

机译：使用表面贴装技术紧固硬件
- 作者：Brian G. Bentrim P.E.
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Fasteners;
- Spacers;
- Standoffs;
- Nuts;
30.MANUFACTURING IMPROVEMENTS ENABLED BY NEW LOW-PRESSURE MOLDING PROCESS

机译：通过新的低压成型过程使得制造改进
- 作者：Michael J. Pierce;Reimer Hansen
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
31.HIGH TEMPERATURE LEAD-FREE SOLDERING IMPACT ON END PRODUCT RELIABILITY

机译：高温无铅焊接对最终产品可靠性的影响
- 作者：Vern Solberg
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-Free;
- RoHS;
- Reliability;
32.ASSEMBLY PROCESS RESEARCH ON 01005 CHIP COMPONENTS IN LEAD-FREE SYSTEM

机译：无铅系统中01005芯片成分的装配过程研究
- 作者：Syber Chen;Xi Cao;Junwen Jin;Fujiang Sun
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- 01005;
- Miniaturization;
- Assembly Process Window;
- Lead Free;
33.BOARD-LEVEL THERMAL CYCLING AND MECHANICAL BEND RELIABILITY OF HiCTE FLIP-CHIP BGAS WITH MULTIPLE BGA PAD SURFACE FINISHES

机译：具有多个BGA焊盘表面的Hicte倒装芯片BGA的板级热循环和机械弯曲可靠性
- 作者：Rajiv Dunne;Kejun Zeng;Sergio Martinez;Venu Chauhan;Mike Estebar;Masood Murtuza;Steve Bezuk
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- HiCTE;
- board-level reliability;
- 4-point bend test;
- ball pull test;
- Coffin-Manson equation;
- NiPdAu;
34.THE EFFECTS OF PLATING PARAMETERS ON THE MICROSTRUCTURE AND WHISKER GROWTH PROPENSITY OF PURE Sn FINISH

机译：电镀参数对纯SN结束微观结构和晶须生长倾向的影响
- 作者：Peng Su;Song Bai;Min Ding;Sheila Chopin
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Sn whiskers;
- plating process;
- X-ray diffraction;
- finite element modeling;
35.IMPACT OF LEAD-FREE PCB SURFACE FINISHES ON MICROVOIDING

机译：无铅PCB表面对微稀疏的影响
- 作者：Guhan Subbarayan;Purushothaman Damodaran;Krishnaswami Srihari;Robert Kinyanjui;Dana Korf
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
36.THERMO-MECHANICAL RELIABILITY OF FLIP-CHIP DEVICES-ONMETAL BACKED FLEX CIRCUITS

机译：倒装芯片器件的热机械可靠性 - Onmetal支持柔性电路
- 作者：Sandesh Rudrapati;Pradeep Lall
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Flip Chip;
- Thermo-mechanical reliability;
- solder joint reliability;
- finite element modeling;
37.EFFECT OF UNDERFILL MATERIAL PROPERTIES ON LOW-K DIELECTRIC, FIRST AND SECOND LEVEL INTERCONNECT RELIABILITY

机译：底部填充材料特性对低k电介质，第一和第二级互连可靠性的影响
- 作者：Mudasir Ahmad;Sue Teng;Jie Xue
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
38.QUALITATIVE EVALUATION OF FLIP CHIP SOLDER BUMPS PRODUCED BY STENCIL PRINTING OF SOLDER PASTE ON VARIOUS ELECTROLESS NICKEL/GOLD METALLIZATIONS

机译：各种化学镀镍/金金属焊膏模型印刷生产倒装芯片焊料凸块的定性评价
- 作者：D. Manessis;R. Patzelt;H. Reichl;L. Boettcher;A. Ostmann;B. Schild;R. Aschenbrenner
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- wafer bumping;
- electroless Ni/Au;
- stencil printing;
- Wafer level CSP packaging;
- shear test;
- high temperature storage;
- multiple reflows;
39.MIXING METALLURGY: RELIABILITY OF SAC BALLED AREA ARRAY PACKAGES ASSEMBLED USING SnPb SOLDER

机译：混合冶金：使用SNPB焊料组装的囊球区域阵列套件的可靠性
- 作者：Heather McCormick;Polina Snugovsky;Zohreh Bagheri;Simin Bagheri;Craig Hamilton;George Riccitelli;Ramesh Mohabir
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead Free;
- Mixed Joints;
- Backwards Compatibility;
40.THE EFFECT OF SURFACE MOUNTING PROCESS ON WHISKER GROWTH IN IC PACKAGE

机译：表面安装过程对IC包装晶须生长的影响
- 作者：Jeffrey C.B. Lee;C.G.Tyan
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Whisker;
- matt Sn;
- SnBi;
- SnPb;
- PCB;
- surface mounting;
- TCT;
- THT;
- corrosion;
- FIB;
41.EPIDEMIOLOGICAL STUDY ON Sn-Ag-Cu SOLDER: BENCHMARKING RESULTS FROM ACCELERATED LIFE TESTING

机译：SN-AG-CU焊料的流行病学研究：加速寿命测试的基准效果
- 作者：Craig Hillman;Nathan Blattau;Ed Dodd;Joelle Arnold
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- SnAgCu;
- SAC;
- Pb-free;
- leadfree;
- chip resistor;
- 2512;
- 1206;
- thin scale outline package;
- TSOP;
- Alloy 42;
- chip scale package;
- CSP;
- ball grid array;
- BGA;
- temperature cycling;
- dwell time;
42.LEAD FREE MANUFACTURING, IS IT REALLY NEW?

机译：无铅制造业，这真的是新的吗？
- 作者：Donald Burr
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
43.INDUSTRY TAKES A PRO-ACTIVE APPROACH: THE AIA-AMC-GEIA LEAD-FREE ELECTRONICS IN AEROSPACE PROJECT WORKING GROUP

机译：行业采取了积极的方法：航空航天项目工作组AIA-AMC-GEIA无铅电子产品
- 作者：Anthony J. Rafanelli;David Pinksy
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Lead-free;
- tin whiskers;
- RoHS;
- WEEE;
44.MANAGING RISK IN OUTSOURCED PRODUCT DEVELOPMENT AND MANUFACTURING

机译：管理外包产品开发和制造风险
- 作者：Larry Fleming
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
45.ASSEMBLY CHALLENGES OF PACKAGE-ON-PACKAGE (PoP)

机译：装配包装套装（POP）的挑战
- 作者：Richard Boulanger
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Package-on-Package;
- PoP;
- Fluxing;
- High-speed assembly;
46.NANOTECHNOLOGY AND ROOM TEMPERATURE ASSEMBLY

机译：纳米技术和室温组装
- 作者：Alan Rae;Andrew Skipor
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
47.RAPID POWER CYCLING OF Pb-FREE SOLDERED COMPONENTS

机译：无铅焊接部件的快速动力循环
- 作者：Nathan Blattau;Danko Priimak;Joelle Arnold;Craig Hillman
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Pb-free;
- failure;
- power;
- fatigue;
- thermal cycling;
- SnAgCu;
- SnNiCu;
- solder;
48.RELIABILITY STUDY OF LEAD-FREE SnAgCu SOLDER JOINTS VS. SnPb SOLDER JOINTS IN QFN PACKAGES

机译：无铅SnAGCU焊点与铅的可靠性研究与QFN封装中的SNPB焊点
- 作者：Donghyun Kim;Mudasir Ahmad;Sue Teng
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
49.NEW COATING TECHNOLOGIES AND ADVANCED TECHNIQUES IN CONFORMAL COATING

机译：全成形涂层的新涂层技术和先进技术
- 作者：Michael Szuch;Alan Lewis;Hector Pulido
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Conformal coating;
- jet coating;
- film coat;
- trimode;
- flow coating;
- bead;
- swirl;
- monofilament;
50.THE EFFECT OF PACKAGING MATERIAL AND PROCESS ON DEVICE PERFORMANCE OF LIGHT EMITTING DIODE

机译：包装材料及工艺对发光二极管器件性能的影响
- 作者：Hyungkun Kim;Yu-Sik Kim;Jeong Wook Lee;Sukho Yoon;Jaehee Cho;Hyunsoo Kim;Cheolsoo Sone;Yongjo Park
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Light emitting diode;
- thermal property;
- dieattach;
- eutectic solder;
- lifetime;
51.A SIMULTANEOUS AND SELECTIVE MICROWAVE SUPPORTED SOLDERING TECHNOLOGY

机译：同时和选择性微波支撑焊接技术
- 作者：Mathias Nowottnick;Wolfgang Scheel;Uwe Pape;Rolf Diehm;Joachim Wiese;Wolfgang Kempe;Marcel Mallah;Manfred Suppa;Peter Fink
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
52.CORRELATING THE PRESENCE OF POPCORNED BGA DEVICES POST REFLOW WITH SOLDER-BALL DIAMETER MEASUREMENTS FROM X-RAY INSPECTION

机译：与X射线检测的焊球直径测量有关爆米花BGA器件的存在与爆裂式回流的存在
- 作者：David Bernard;Bob Willis
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Popcorning;
- popcorned;
- BGA;
- lead-free;
- x-ray inspection;
- moisture sensitivity level;
53.A STUDY OF COPPER DISSOLUTION DURING LEAD FREE PTH REWORK USING A THERMALLY MASSIVE TEST VEHICLE

机译：使用热批量试验载体的无铅PTH返工铜溶解研究
- 作者：Craig Hamilton;Polina Snugovsky;Matthew Kelly
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Cu dissolution;
- PTH rework;
- Sn-Ag-Cu;
- process window;
54.ON AGING EFFECT OF FLIP CHIP SOLDER BUMPS

机译：倒装芯片焊料凸块的老化效果
- 作者：Mukul Joshi;Raghunandan Chaware
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Flip Chip BGA (FCBGA);
- Wafer Bumping;
- Intermetallics;
- UBM;
- Aging;
- Reliability.;
55.PACKAGING OF POWER LEDS USING THERMOSONIC BONDING OF Au-Au INTERCONNECTS

机译：使用Au-Au互连的热循环键合的电力LED的包装
- 作者：Seck-Hoe Wong;Mooi Guan Ng;Mee-Lee Yong;Nooralshikin Hussain;Syivaram Balakrishnan;Khai-Chow Ng;Young-Keat Beh;Shatil Haque
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- Au stud bumping;
- thermosonic bonding;
- flipchip die-attach;
- surface mount LED package;
- LED packaging;
56.RELIABILITY STUDY OF LEAD-FREE AREA ARRAY PACKAGES WITH TIN-LEAD SOLDERING PROCESSES

机译：锡引线焊接工艺无铅区域阵列套件的可靠性研究
- 作者：Jennifer Nguyen;David Geiger;Daniel Rooney Ph.D.;Dongkai Shangguan Ph.D.
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- reliability;
- lead-free;
- SnAgCu alloy;
- mixed alloy;
- backward compatibility;
- backward compatible assembly;
- tin percentage;
- reflow temperature;
57.AN EXPERIMENTAL STUDY OF PRESS-FIT INTERCONNECTION ON LEAD FREE PLATING FINISHES

机译：压配互连对引线无铅镀层的实验研究
- 作者：Ila Pal;Elena Smolentseva
- 会议名称：《Industry's Best Technical Conference on Electronic Assembly and Advanced Packaging》 | 2006年
- press-fit terminal;
- RoHS;
- lead free;
- plated through hole;
- interconnection;
- testing standards;
- Kelvin measurements;
- pin retention force;