LEAD-FREE AND COPPER-FREE TIN ALLOY AND SOLDER BALL FOR BALL GRID ARRAY PACKAGE

摘要

A lead-free and copper-free tin alloy has 3.0-5.0 wt % (weight percentage) silver, 0.01-3.5 wt % bismuth, 0.01-3.5 wt % antimony, 0.005-0.1 wt % nickel, 0.005-0.02 wt % germanium and tin of a residual weight percentage. The lead-free and copper-free tin alloy can be used to manufacture solder ball for a ball grid array package, and the solder bump formed by the solder ball can withstand the thermal stress caused by the temperature change of the electronic component itself or the environment, and has the ability to withstand high mechanical shocks at the same time.