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Process Development for Lead-Free Selective Soldering

机译:无铅选择性焊接的过程开发

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This investigation identifies and characterizes the critical parameters that arc involved in the selective soldering process. In this paper, the various process steps including fluxing, preheating and soldering will be discussed with respect to the lead-free process, and compared/contrasted to wave soldering where possible, to illustrate differences as well as similarities. This paper concludes that selective lead-free soldering is technologically feasible.
机译:该研究识别并表征了弧形涉及选择性焊接过程的关键参数。在本文中,将关于无铅工艺讨论包括熔融,预热和焊接的各种工艺步骤,并在可能的情况下比较/对比于波焊,以说明差异以及相似性。本文得出结论,选择性无铅焊接在技术上是可行的。

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