Low temperature sintering metallo-organic silver paste

摘要

A new metallo-organic compound technology has been used for the development of conductive materials. Liquid metallo-organic (MO) silver paste is prepared by a reaction between carboxyl silver and amines/acids. The coordinated compound material will be decomposed by heating and a perfect silver layer can be obtained. It is possible to make well-defined continuous layers of silver for various purposes by adjusting the process with organic acids and amines. The conductive silver layer obtained by the described process has shown excellent performance, which can be compared to the performance of conventional silver thick film paste or silver resinate. MO silver paste can be baked at temperatures far below 600°C, which is a big advantage as it saves both time and energy when comparing with conventional thick film conductive paste. MO silver can be printed on a polyimide (PI) film and be baked at 150 °C -270 °C. An electrode made this way was baked at 250 °C, it had a thickness of 1 μm and the volume resistivity was as low as 4 × 10{sup}(-6) Ω·cm. This proves that very thin electrodes like plating can be made by this type of printing process. MO silver paste applied to termination electrodes of multi layer ceramic capacitor (MLCC) and baked at 250 °C made excellent termination electrodes with high capacitance and low dielectric tangent. This method with MO silver does not need a Nitrogen atmosphere for the baking phase.