Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

摘要

Six low-temperature-curing silver pastes were prepared from silver flake, α-terpineol and various metallo-organic decomposition (MOD) compounds. The thermal decomposition behaviors of the pastes were determined. The microstructures and resistivities of screen-printed films on alumina substrate after thermal treatment were characterized and discussed. Results indicated that 2-ethylhexanoate possesses the lowest decomposition temperature (190.3℃) among the MOD agents studied, and it forms silver particles to promote the linking of silver flake powders and thus reduces the resistivity to < 13 μΩ·cm at a temperature as low as 200℃.