This paper presents a wafer-level MEMS vacuum packagingprocess by using RTP (Rapid Thermal Processing)aluminum-to-nitride bonding. The measured quality factorof a vacuum-packaged comb-resonator is 1800±200 correspondingto a 200mTorr vacuum inside the packaged microcavity. Both long-term and accelerated vacuum stabilitytests are conducted to characterize the durability ofthe packages. It is found that the vacuum quality hasnot degraded over a period of 9 weeks under regular environmentand over a period of 24 hours under a harshenvironment(130oC, 2.7atm and 100% RH) in the autoclavetest. In an e?ort to address the issue of post-packaging frequencytuning, a pulsed laser deposition method is developedby using either indium or aluminum as the depositionmaterial for frequency tuning. A maximum of 18.1% reductionin frequency has been achieved and a ?rst-order,linear model is found adequate to explain the frequencytuning results.
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