Wafer-level packaging methods using a photolithographic bonding material

摘要

A wafer-level packaging method includes providing a base substrate and providing first chips. A photolithographic bonding layer is formed on the base substrate or on the first chips. First vias are formed in the photolithographic bonding layer. The first chips are pre-bonded to the base substrate through a photolithographic bonding layer with each first chip corresponding to a first via. A thermal compression bonding process is used to bond the first chips to the base substrate such that an encapsulation material fills between adjacent first chips and covers the first chips and the base substrate. The base substrate is etched to form second vias through the base substrate with each second via connected to a first via to form a first conductive via. A first conductive plug is formed in the first conductive via to electrically connect to a corresponding first chip.