机译:晶圆级真空密封通过将硅盖的转移键合用于小型占地面积和超薄MEMS封装
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
KTH Royal Inst Technol Div Micro & Nanosyst Sch Elect Engn & Comp Sci S-10044 Stockholm Sweden;
Vacuum; hermetic; packaging; sealing; MEMS; ultra-thin package; small footprint; transfer bonding; 3D integration; flip chip; aluminum; gold; thermo-compression bonding;
机译:通过小面积和超薄MEMS封装的硅盖转移键合进行晶圆级真空密封
机译:MEMS和相关微系统的晶圆级真空封装的选择性键合和封装
机译:通过小尺寸的铜密封圈的塑性变形和低温焊接实现晶圆级真空包装
机译:用于硅光子MEMS包装的晶片级真空密封
机译:碳化硅与钢的固液互扩散键合,用于高温MEMS传感器的包装和键合。
机译:基于键合的晶片级真空封装使用原子氢预处理的铜键合框架
机译:晶圆级真空密封通过将硅盖的转移键合用于小型占地面积和超薄MEMS封装