Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

摘要

Wafer-level vacuum packaging is vital in the fabrication of many microelectromechanical systems (MEMS) devices and enables significant cost reduction in high-volume MEMS production. In this paper, we propose a low-temperature wafer-level vacuum packaging method based on plastic deformation and low-temperature welding of copper sealing rings with a small footprint. A device wafer with copper ring structures and a cap wafer with corresponding metalized grooves are placed inside a vacuum chamber and pressed together at a temperature of 250 ̊C, resulting in low-temperature welding of the copper, and thus, hermetic sealing of the cavities enclosed by the sealing rings. The vacuum pressure inside the fabricated cavities 146 days after bonding was measured using residual gas analysis to be as low as 2.6×10-2 mbar. Based on this value, the leak rate is calculated to be smaller than 3.6×10-16 mbarL/s using the most conservative assumptions, demonstrating the excellent hermeticity of the seals. Shear testing was used to demonstrate that the seals are mechanically stable with over 90 MPa in shear strength for 5.2 μmhigh Cu sealing rings with widths down to 8 μm. The reported method is potentially compatible with complementary metaloxide-semiconductor (CMOS) substrates and may be applied to vacuum packaging of 3-D heterogeneously integrated MEMS on state-of-the-art CMOS substrates.