TiN Hardmask Wet Etching and Post Etch Residue Removal in BEoL for advanced Technology nodes:Effects of material deposition and etch compositions(PPT)

摘要

In the semiconductor industry,titanium nitride is often used as an inorganic hard mask,enabling the robust creation of structures(vias and trenches)with widths down to at least 5nm.After the vias and trenches are created,using plasma etching techniques,the hard mask has to be vemoved again by a wet chemical process,as its presence during final manufacturing steps would severely impact device performance or would increase process complexity in the subsequent process steps.