Assessment methodology on mold void defect by scanning acoustic microscopy (SAM) non-destructive Technique

摘要

Scanning acoustic microcopy (SAM) method with inverted inspection direction has been successfully develop and evaluate the quality of flip chip underfill and interconnect bonds in manufacturing of microelectronic components. Acoustic microscopes utilize high frequency ultrasound transmitting through the silicon chip backside in one scan to access and examine the internal structures in optically opaque materials. These non-destructive methods relatively enable the defect localization which leads microstructural examinations involving destructive analysis sample preparation. For the justification of accuracy of SAM method analysis, a destructive cross-sectioned and mechanical lapping physical analysis were performed for preparing the samples and examine by optical microscope and Scanning Electron Microscope (SEM) for defect verification. Cases studies have been demonstrated that the capabilities of conventional SAM inspection and advantages over other analysis method.