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Reliability evaluation and failure analysis of AlGaN/GaN high electron mobility transistor by photo emission microscope

机译:光发射显微镜AlGaN / GaN高电子迁移率晶体管的可靠性评价与故障分析

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摘要

In this paper, the reliability in AlGaN/GaN HEMTs has been assessed by analyzing the spatial intensity distribution of electroluminescence (EL) detected by Photo Emission Microscope (PEM) during the OFF-state step-stress experiment. And it is found that a relationship between breakdown point and hot spots was confirmed. In addition, we report on the different of EL image before and after failure. Hence, the PEM may as a method to analyze the devices which fail after suffering momentary high voltage.
机译:本文通过分析光发射显微镜(PEM)在脱态阶跃应力实验期间,通过分析光发光显微镜(PEM)的空间强度分布来评估AlGaN / GaN Hemts的可靠性。结果发现,确认了击穿点和热点之间的关系。此外,我们在故障之前和之后报告EL图像的不同。因此,PEM可以作为分析在持续瞬时高压之后失效的装置的方法。

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