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Experimental Study of the Impact of SO Phonon Scattering in High-κ Gate Dielectric MOSFETs

机译:高κ门电介质MOSFET中所以SO SO散射冲击的实验研究

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The phonon limited carrier mobility in MOSFETs is found to be accurately described by an exponential relationship over a wide range of temperature and electric field. It is shown that low temperature mobility is more sensitive to SO phonon scattering in comparison to high temperature mobility. Hence the impact of SO phonon scattering is not readily discerned using the conventional power law behaviour which shows significant deviation at low temperatures from experiment. It is established using the exponential model that the sensitivity factor, β, for TiN/HfO{sub}2 in these samples is about half that of poly-Si/HfO{sub}2 at T= 294K. Correspondingly the maximum SO limited mobility in poly-Si/HfO{sub}2 degrades by about 52% relative to TiN/HfO{sub}2 in the high field region at T =294 K whereas poly-Si/Hf silicate degrades by 22% in relation to SiO{sub}2. A combination of poly-Si/Hf silicate results in complete recovery from phonon scattering whereas TiN/HfO{sub}2 remains degraded by 35% at 150 K.
机译:发现MOSFET中的载波有限的载波移动性通过在宽范围的温度和电场上进行指数关系来精确描述。结果表明,与高温迁移率相比,低温迁移率对所以声子散射更敏感。因此,使用传统的电力法行为不容易辨别出Shonon散射的影响,这在实验中显示出在低温下显着偏差。它是使用指数模型来建立的,这些模型是这些样品中的锡/ hfo {sub} 2的敏感性因子,β是t = 294k的聚-Si / hfo {sub} 2的一半。相对于T = 294k的高场区域中,多Si / HFO {Sub} 2中的最大如此有限的迁移率相对于高场区域中的锡/ hfo {sub} 2降低了约52%,而Poly-si / hf硅酸盐含有22与SIO {sub} 2有关的%。聚-SI / HF硅酸盐的组合导致来自声子散射的完全恢复,而TIN / HFO {sub} 2保持在150k下的35%降解。

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