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Influence of Substrate Roughness on the Formation of Defects in 3C-SiC Grown on Si(110) Substrate by Hetero-epitaxial CVD Method

机译:杂交外延CVD法对Si(110)底物上的3C-SiC缺陷形成的影响

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Interfaces between a Si(110) substrate and 3C-SiC crystals grown hetero-epitaxially by CVD were investigated by cross-sectional transmission electron microscopy. Gas flow condition during the carbonization process affects the roughness of the substrate surface and there is an optimum condition to preserve the flat surface. High quality 3C-SiC crystals grew only on the flat substrate, with crystallographic relationship of Si[110]//SiC[110] and Si[001]//SiC[112], because the well-lattice-match relationship was limited in a two-dimensional region at the SiC(111)/Si(110) interface. Using the optimum condition, some kinds of roughness at an atomic scale remained on the surface of the substrate. Nanoscopic observation of the ciystals grown on an off-axis substrate revealed the influence of the roughness on the epitaxial growth and the defects generation at the interface.
机译:通过横截面透射电子显微镜研究了Si(110)衬底和3C-SiC晶体之间的界面生长杂外膜,CVD研究。碳化过程中的气体流动条件影响基板表面的粗糙度,并且存在最佳条件以保持平坦表面。高质量的3C-SiC晶体仅在扁平基板上增长,具有Si [110] // SiC [110]和Si [001] // SiC [112]的晶体关系,因为晶格匹配的关系有限SiC(111)/ Si(110)接口处的二维区域。使用最佳条件,原子尺度的某种粗糙度保持在基板的表面上。在轴外基板上生长的纳米镜观察显示粗糙度对外延生长的影响和界面处产生的缺陷。

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