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4H-SiC Lateral RESURF MOSFETs on Carbon-face Substrates

机译:碳面基板上的4H-SIC横向RESURF MOSFET

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We have fabricated lateral RESURF MOSFETs on 4H-SiC(0001) Si-face and (000-1) C-face substrates, and compared those properties. The channel mobility of a lateral test MOSFET on a C-face was 41 cm~2/Vs, which was much higher than 5 cm~2/Vs for that on a Si-face. The specific on-resistance of the lateral RESURF MOSFET on a C-face was improved to 79 mOMEGAcm~2 as comparison with 2400 mOMEGAcm for Si-face. The breakdown voltage was 490V for Si-face and 460V for C-face, which was 82 percent and 79 percent of the designed breakdown voltage of 600V, respectively. The device breakdown occurred destructively at the gate electrode edge.
机译:我们在4H-SiC(0001)Si-Face和(000-1)C面基板上制造了横向Resurf MOSFET,并比较了这些性质。 C形面上的横向试验MOSFET的沟道迁移率为41cm〜2 / vs,在Si面上高于5cm〜2 / Vs。横向Resurf MOSFET在C脸上的具体导通电阻得到改善为79莫美汞〜2,与SI面的2400莫美汞相比。击穿电压为Si-Face的490V,C-Face为460V,分别为600V的设计击穿电压的82%和79%。设备故障在栅极电极边缘处破坏性地发生。

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