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Enabling operational excellence through an integrated Manufacturing IT Baseline

机译:通过综合制造IT基线启用卓越运营

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The 300mm Technology has forced the semiconductor industry to take a broader perspective on the classical understanding of production and Shop-Floor Control. In consequence the focus shifted from the perspective of Transport Automation and Manufacturing Execution Systems to the integrated Factory, viewing all involved elements for semiconductor production. In Pre-300mm, the process-engineering domain saw limited overlap to production logistic and transport. Today the linkage and integration of process control and shop-floor control and production logistic is acknowledged as key factor for operational excellence. They are the Enabling Technologies, for the high-end "Manufacturing Operations Management". The required technologies for the integrated manufacturing are not available off-the-shelf in the market. Unlike in the financial and enterprise resource planning area, the shop-floor is lacking of predefined workflows, addressing and offering the work-procedures and-processes of a highly automated semiconductor operations. This paper gives real-case insight on (1) how to build a comprehensive standard for the high-end automation and production efficiency. (2) how to increase process control, equipment utilization and factory uptime towards better cycle time and output through an integrated industrial automation solution baseline for shop-floor and engineering.
机译:300毫米的技术迫使半导体行业对生产和车间控制的经典理解进行更广泛的视角。结果,重点从传输自动化和制造执行系统的角度转移到集成工厂,查看了半导体生产的所有涉及元素。在300毫米之前,工艺工程域锯有限地重叠到生产物流和运输。今天,过程控制和车间控制和生产后勤的联系和整合被认为是卓越运营的关键因素。它们是高端“制造运营管理”的启用技术。综合制造所需的技术在市场上不可提供。与金融和企业资源规划区不同,商店楼层缺乏预定义的工作流程,寻址和提供高度自动化半导体操作的工作程序和过程。本文对(1)如何为高端自动化和生产效率构建全面标准,提供实际情况洞察力。 (2)如何通过综合工业自动化解决方案基线增加流程控制,设备利用和工厂正常运行时间,通过集成工业自动化解决方案和工程。

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